| 摘要 |
<P>PROBLEM TO BE SOLVED: To raise accuracy while reducing calculation time required for OPC model calibration. <P>SOLUTION: A pattern measuring device includes: a storage part which stores mask edge data on a circuit pattern of a semiconductor, and image data obtained by picking up the circuit pattern; a SEM (Scanning Electron Microscope) contour line extraction part which extracts a SEM contour line of the circuit pattern by using the image data as input, and makes an exposure simulation part generate data (predicted SEM contour line data) on a predicted SEM contour line based on the mask edge data and the extracted data (SEM contour line data) on the SEM contour line; a shape classification part which classifies the SEM contour line data and the predicted SEM contour line data into contour lines in the one-dimensional shape and contour lines in the two-dimensional shape by using the mask edge data, the SEM contour line data, and the predicted contour line data as input; and a SEM contour line sampling part which performs sampling of the SEM contour line data according to types of the one-dimensional shape and the two-dimensional shape by using the SEM contour line data and the predicted SEM contour line data as input. <P>COPYRIGHT: (C)2013,JPO&INPIT |
