A HEAT SLUGE IMPROVEMENTED BOARD

摘要

PURPOSE: A heat slug is provided to improve adhesion between a semiconductor package and the heat slug by forming a slug uneven part in the outer circumference of the heat slug. CONSTITUTION: A semiconductor chip is embedded in a semiconductor package(10). A heat slug(20) is close to the upper side of the semiconductor package discharges heat from the semiconductor chip. The heat slug is composed of a slug body which upwardly protrudes and a slug adhesive part. An adhesive is formed on the lower side of the slug adhesive part. The slug adhesive part includes a slug uneven part. The slug adhesive part is extended from the outer circumference of the slug body and is close to the inner circumference of the upper side of the semiconductor package.