| 摘要 |
<P>PROBLEM TO BE SOLVED: To stabilize the moldability of a resin when resin-sealing is performed in a resin sealing type semiconductor package device. <P>SOLUTION: For example, in a semiconductor package device, a chip 10, where a bonding pad group is provided at one side, is mounted on a lead frame 11 and is sealed with a resin 15. In the semiconductor package device, the lead frame 11 has a pair of internal lead groups 11a and 11b, and the chip 10 is mounted on the longer internal lead group 11b and hanging pin parts 11f through an organic insulation film 12 on a rear surface of the chip 10. Each hanging pin part 11f is connected with the outmost internal lead of the longer internal lead group 11b and is fastened to the rear surface of the chip 10 to stably hold the chip 10. <P>COPYRIGHT: (C)2013,JPO&INPIT |
