| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition excellent in heat conductivity, particularly to provide a resin composition suitable as a heat dissipation member for electronic parts. <P>SOLUTION: The high-heat conductive resin composition contains 80 to 90 vol% of a spherical aluminum oxide powder and an aluminum oxide powder, wherein the spherical aluminum oxide powder has an average sphericity of ≥0.85, ≤30 hydroxide groups/nm<SP POS="POST">2</SP>and an average particle diameter of 10 to 50 μm; the aluminum oxide powder has an average particle diameter of 0.3 to 1 μm; and the blend proportion of the spherical aluminum oxide powder and the aluminum oxide powder is 5:5 to 9.5:0.5 in volume ratio. The spherical aluminum oxide powder and the aluminum oxide powder are preferably surface treated with a silane coupling agent. <P>COPYRIGHT: (C)2013,JPO&INPIT |
