| 发明名称 |
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE REGENERATION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which reattachment of a semiconductor package is easy after detaching the semiconductor package from a circuit board. <P>SOLUTION: A semiconductor device comprises: a circuit board; a semiconductor package; a solder bonding part electrically connecting the circuit board and the semiconductor package; and a plate-like member arranged between the circuit board and the semiconductor package and having a hole through which the solder bonding part passes, in which the hole is formed such that the narrowest part of the hole is thinner than the solder bonding part arranged on the semiconductor package side. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013058506(A) |
申请公布日期 |
2013.03.28 |
| 申请号 |
JP20110194484 |
申请日期 |
2011.09.07 |
| 申请人 |
FUJITSU LTD |
发明人 |
NAKANISHI TERU;HAYASHI NOBUYUKI;MORITA OSAMU;YONEDA YASUHIRO |
| 分类号 |
H01L21/60;H01L21/58;H05K3/34 |
主分类号 |
H01L21/60 |
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