Thin film forming apparatus

摘要

Provided is a thin film forming apparatus that enables operation time reduction for thin film formation and cost decrease for the film forming operation by efficiently simplifying an operation of forming a thin film only on a specific portion on a plurality of substrates. A substrate holding mechanism 3 which is provided in a thin film forming apparatus 100 includes: substrate holding members 10-40 which hold a plurality of substrates S in a manner that a part of a non-film forming portion S2 of a substrate S overlaps the other substrate and a film forming portion S1 is exposed, a support member 50 which supports the substrate holding members 10-40, and a rotation member 60 which rotates the support member 50; in which the substrate holding members 10-40 include: a plurality of holding surfaces 11d which holds the plurality of substrates S and is disposed between a film forming source 4 and the plurality of substrate S, a plurality of step portions 11e which is formed between the plurality of holding surfaces 11d in a manner that ends of the plurality of substrates S respectively come into contact with the step portions 11e, and a plurality of opening portions 11f which are formed on the holding surfaces 11d of the portion corresponding to the film forming portion S1 when the ends of the substrates S come into contact with the plurality of the step portions 11e.