发明名称 SEMICONDUCTOR PACKAGE
摘要 PURPOSE: A semiconductor package is provided to improve the structural stability and reliability of a semiconductor package by using an underfill resin layer. CONSTITUTION: An outer circuit layer is formed in a base substrate and includes a connection pad(115) and a circuit pattern(117). A solder resist layer(120) is formed on the base substrate. The solder resist layer has an opening part for exposing a part of the circuit pattern. A semiconductor chip(130) is formed on the base substrate. An underfill resin layer(140) is formed between the base substrate and the semiconductor chip.
申请公布号 KR20130030039(A) 申请公布日期 2013.03.26
申请号 KR20110093543 申请日期 2011.09.16
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, DONG UK;NOH, SEUNG HYUN
分类号 H01L23/48;H01L23/28 主分类号 H01L23/48
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