| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a face up type light emitting element which reflects light by a reflection metal included on the rear surface side of a substrate with high reflectivity and thereby improving the light extraction efficiency and achieves excellent adhesiveness between the reflection metal and the substrate, and to provide a light emitting element package including the light emitting element. <P>SOLUTION: A light emitting element 1 is used at a face-up position and is composed of: a substrate 2; a nitride semiconductor lamination structure part 9 having an n type GaN layer 6, a light emitting layer 7, and a p type GaN layer 8 which are sequentially laminated on a surface 3 of the substrate 2; a transparent adhesive layer 10 formed on a rear surface 4 of the substrate 2; a reflection metal 11 which is formed by alloy containing Ag, a Pt group metal, and Cu and formed on a rear surface of the transparent adhesive layer 10 while contacting with the transparent adhesive layer 10; and a joining metal 13 formed on a rear surface of the reflection metal 11. <P>COPYRIGHT: (C)2013,JPO&INPIT |
