发明名称 LIGHT-EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To prevent deterioration in reliability due to self-heating caused when an LED is lit. <P>SOLUTION: A light-emitting device includes a bonding wire 18 electrically connecting an LED chip 11 and a mounting substrate 12. The wire straddles a gap 23 between a side surface of a window hole 16 of an insulating substrate 15 and a side surface of a submount 17, is formed in a coil shape, and is expandable/contractible. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013055346(A) 申请公布日期 2013.03.21
申请号 JP20120241763 申请日期 2012.11.01
申请人 NEC LIGHTING LTD 发明人 UEJI HIROMICHI;OKIMURA KATSUYUKI
分类号 H01L33/62;H01L21/60;H01L23/28 主分类号 H01L33/62
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