发明名称 |
INTEGRATED CIRCUIT WITH SENSOR AND METHOD OF MANUFACTURING SUCH AN INTEGRATED CIRCUIT |
摘要 |
An integrated circuit package for an integrated circuit having one or more sensor elements in a sensor element area of the circuit. An encapsulation covers bond wires but leaves an opening over the sensor element area. A protection layer is provided over the integrated circuit over which the encapsulation extends, and it has a channel around the sensor element area to act as a trap for any encapsulation material which has crept into the opening area.
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申请公布号 |
US2013069176(A1) |
申请公布日期 |
2013.03.21 |
申请号 |
US201213610692 |
申请日期 |
2012.09.11 |
申请人 |
DAAMEN ROEL;BOUMAN HENDRIK;TAK COENRAAD CORNELIS;NXP B.V. |
发明人 |
DAAMEN ROEL;BOUMAN HENDRIK;TAK COENRAAD CORNELIS |
分类号 |
H01L29/66;H01L21/02 |
主分类号 |
H01L29/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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