| 摘要 |
An electronic part mounting method and device for mounting an electronic part while making the most of the advantages of thermocompression bonding using an elastic body so as to enable reduction of voids to an irreducible minimum and significant reduction of defective connections. An electronic part (IC chip (12)) is placed on a wiring board (11) through an adhesive (for example, an anisotropic conductive adhesive film (13)). The IC chip (12), or the electronic part, is pressed with a thermocompression bonding head (2) having a press-bonding portion (4) made of an elastic body, and the anisotropic conductive adhesive film (13) is heated, thereby thermocompression-bonding the IC chip (12) to the wiring board (11). The applied pressure by the thermocompression bonding head (2) is determined so as to reach a predetermined pressure (pressure necessary to get rid of the voids) before the temperature of the anisotropic conductive adhesive film (13) reaches the curing start temperature K of a binding resin (13a) contained in the anisotropic conductive adhesive film (13). |
