<p>A polishing pad for chemical mechanical polishing having at least a polishing layer, wherein the polishing surface of the polishing layer has a first groove and a second groove, and the first and the second grooves have side surfaces that are continuous with the polishing surface at the widthwise edges of each of the grooves. In the first groove, the angle between the polishing surface and the side surface continuous with the polishing surface is 105-150°on at least one widthwise edge of the groove. In the second groove, the angle between the polishing surface and the side surface continuous with the polishing surface is 60-105°on both widthwise edges of the groove.</p>
