发明名称 |
Grounding structures for header and receptacle assemblies |
摘要 |
A receptacle assembly includes a contact module having a conductive holder has a first side and an opposite second side. The conductive holder has a chamber between the first and second sides. A frame assembly is received in the chamber of the conductive holder. The frame assembly includes a plurality of contacts and a dielectric frame supporting the contacts. The contacts extend from the conductive holder for electrical termination. A ground lead frame is received in the chamber between the frame assembly and the conductive holder. The ground leadframe has grounding members that extend from the conductive holder for electrical termination to header shields of the header assembly. |
申请公布号 |
US8398432(B1) |
申请公布日期 |
2013.03.19 |
申请号 |
US201113290499 |
申请日期 |
2011.11.07 |
申请人 |
MCCLELLAN JUSTIN SHANE;MCCLINTON JEFFREY BYRON;FEDDER JAMES LEE;SWANGER NATHAN WILLIAM;PICKLES CHARLES S.;MINNICK TIMOTHY ROBERT;MORGAN CHAD W.;SARASWAT DHARMENDRA;TYCO ELECTRONICS CORPORATION |
发明人 |
MCCLELLAN JUSTIN SHANE;MCCLINTON JEFFREY BYRON;FEDDER JAMES LEE;SWANGER NATHAN WILLIAM;PICKLES CHARLES S.;MINNICK TIMOTHY ROBERT;MORGAN CHAD W.;SARASWAT DHARMENDRA |
分类号 |
H01R13/648 |
主分类号 |
H01R13/648 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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