发明名称 Wiring layer, semiconductor device and liquid crystal display device
摘要 Provided is an electrode layer and a wiring layer, which are free from peeling from a glass substrate. A wiring layer and a gate electrode layer are constituted by an adhering film which is a thin film made of Cu—Mg—Al formed on a surface of a glass substrate, and a copper film formed on the adhering film. When the adhering film includes Mg in a range of at least 0.5 atom % and at most 5 atom %, and aluminum in a range of at least 5 atom % and at most 15 atom %, assuming that the total number of atoms of copper, magnesium and aluminum is taken as 100 atom %, adhesion of the adhering film to the glass substrate becomes high, and the copper thin film is not peeled from the glass substrate. The wiring layer is electrically connected to a pixel electrode of a liquid crystal display device.
申请公布号 US8400594(B2) 申请公布日期 2013.03.19
申请号 US201213403145 申请日期 2012.02.23
申请人 TAKASAWA SATORU;SHIRAI MASANORI;ISHIBASHI SATORU;ULVAC, INC. 发明人 TAKASAWA SATORU;SHIRAI MASANORI;ISHIBASHI SATORU
分类号 G02F1/1335 主分类号 G02F1/1335
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