发明名称 THERMOSETTING RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that has elongation, folding resistance, flex resistance, and low warpage, and further includes hardness, wherein a cured product excellent in elasticity can be obtained. <P>SOLUTION: The thermosetting resin composition comprises an epoxy resin (A), an inorganic compound (B) having an aspect ratio of 5.0 or larger, polyether amine (C), a liquid polyalkylene carbonate diol (D), and a blocked isocyanate (E). <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013049781(A) 申请公布日期 2013.03.14
申请号 JP20110188173 申请日期 2011.08.31
申请人 TAMURA SEISAKUSHO CO LTD 发明人 KUMAGAI KAZUHIKO;KAKIUCHI NAOYA
分类号 C08L63/00;C08G59/56;C08K3/00;C08K5/29;C08L69/00;C08L71/00 主分类号 C08L63/00
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