ELECTRONIC COMPONENT MODULE AND METHOD FOR PRODUCING SAME

摘要

The aim of the present invention lies in providing an electronic component module which can reliably shield an electronic component installed on a substrate from external electromagnetic waves, even with a low profile, and also a method for producing the electronic component module. One or more electronic components (12) are installed on a circuit board (11) in an electronic component module (1). The electronic component module (1) is provided with: a conductive film (15) which covers the electronic component(s) (12); and an external connection terminal (20) which is provided in such a way as not to come into contact with the conductive film (15). The conductive film (15) is in contact with the top surface and side surface of the electronic component(s) (12) and is connected to an earth electrode (16) provided inside the circuit board (11).