METHOD FOR MANUFACTURING BUMP IN FILM

摘要

PURPOSE: A film protrusion forming method is provided to form protrusions on a large number of films once at a time. CONSTITUTION: A sacrifice metal layer is formed on a wafer and multiple protrusions having conductive materials are formed on the top surface of the sacrifice metal layer(S310,S320). A sacrifice metal layer is etched so that part of the sacrifice metal layer formed on each lower surface of the protrusions has a smaller size than the protrusion(S330). The top surface of a corresponding protrusion among the protrusions is bonded to the corresponding position of a film(S340). The part of the sacrifice metal layer formed on the lower surface of the protrusions bonded to the film and the wafer are separated(S350). [Reference numerals] (AA) Start; (BB) End; (S310) Forming a sacrifice metal layer on a wafer; (S320) Forming protrusions on the sacrifice metal layer; (S330) Etching the sacrifice metal layer so that part of the sacrifice metal layer formed on each lower surface of the protrusions has a smaller size than the protrusion; (S340) Bonding the top surface of the protrusions corresponding to a film; (S350) Separating the wafer and the part of the sacrifice metal layer formed on the lower surface of the protrusion bonded on the film