发明名称 |
Semiconductor chip stacked body and method of manufacturing the same |
摘要 |
A plurality of chip sealing bodies stacked on a wiring substrate with a connection terminal. The chip sealing body includes a semiconductor chip having a semiconductor integrated circuit, a pad and a conductive connecting material, and a resin sealing the semiconductor chip. The chip sealing body is shaped into a cubic form in which a portion of the conductive connecting material except an end portion located on an external device side and all surfaces of semiconductor chip is sealed by the resin and the end portion of the conductive connecting material located on the external device side is exposed from the cubic form. A conductive bonding wire connects the end portions of the conductive connecting materials and the connection terminal respectively. A resin sealing material seals the plurality of chip sealing bodies, the conductive bonding wire, and the wiring substrate. |
申请公布号 |
US8394678(B2) |
申请公布日期 |
2013.03.12 |
申请号 |
US20090626069 |
申请日期 |
2009.11.25 |
申请人 |
MURAYAMA KEI;SHIRAISHI AKINORI;AIZAWA MITSUHIRO;SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
MURAYAMA KEI;SHIRAISHI AKINORI;AIZAWA MITSUHIRO |
分类号 |
H01L21/00;H01L23/02;H01L23/22;H01L23/24;H01L23/52 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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