| 摘要 |
A test apparatus tests a DUT formed on a wafer. A power supply compensation circuit includes source and a sink switches each controlled according to a control signal. When the source or sink switch is turned on, a compensation pulse current is generated, and the compensation pulse current is injected into a power supply terminal of the DUT via a path that differs from that of a main power supply, or is drawn from the power supply current that flows from the main power supply to the DUT via a path that differs from that of the power supply terminal of the DUT. Of components forming the power supply compensation circuit, including the source and sink switches, a part is formed on the wafer. Pads are formed on the wafer in order to apply a signal to such a part of the power supply compensation circuit formed on the wafer. |
