发明名称 The printed circuit board and the method for manufacturing the same
摘要 Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a flexible substrate divided into first, second, and third regions, a first rigid substrate in the first region of the flexible substrate, and a second rigid substrate in the third region of the flexible substrate. The first and second substrates expose the second region of the flexible substrate.
申请公布号 KR101241544(B1) 申请公布日期 2013.03.11
申请号 KR20110056536 申请日期 2011.06.10
申请人 发明人
分类号 H05K1/02;H05K3/46 主分类号 H05K1/02
代理机构 代理人
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