EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME

摘要

PURPOSE: An epoxy resin composition is provided to improve thermal conductivity by using epoxy resin which comprises a mesogen structure capable of increasing crystallinity. CONSTITUTION: An epoxy resin composition comprises an epoxy resin, hardener, and inorganic filler as a main component. The epoxy resin comprises an epoxy resin indicated in chemical formula 1. In the chemical formula 1, n is an integer from 0-10. The comprised amount of the epoxy resin indicated in the chemical formula 1 is 50 wt% or more and the comprised amount of the inorganic filler is 40-97 wt% based on the total weight of the epoxy resin composition. The inorganic filler is selected from alumina, boron nitride, aluminum nitride, crystalline silica, or silicon nitride.