LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a laminated ceramic electronic component which improves sealing performance of chips and is superior in reliability.

SOLUTION: The laminated ceramic electronic component includes: a ceramic main body 10 including a dielectric layer 1; first and second internal electrodes 21 and 22 oppositely arranged in the ceramic main body 10 through the dielectric layer 1; a first external electrode 31 which is electrically connected to the first internal electrode 21; and a second external electrode 32 which is electrically connected to the second internal electrode 22. The first and second external electrodes 31 and 32 contain conductive metal and glass. When at least one of the first and second external electrodes 31 and 32 is divided into three equal portions in a thickness direction, the glass occupies 35 to 80% by area with respect to the area of a center part region.

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