| 摘要 |
A chip-housing module including a carrier configured to carry one or more chips; the carrier including: a first plurality of openings, wherein each opening of the first plurality of openings is separated by a first pre-determined distance, and is configured to receive a chip connection for providing a voltage lying within a first range of voltage values to a chip; a second plurality of openings, wherein each opening of the second plurality of openings is separated by a second pre-determined distance, and configured to receive a chip connection for providing a voltage lying within a second range of voltage values to a chip; and wherein a pair of openings consisting of one opening of the first plurality of openings and one opening of the second plurality of openings is separated by a distance different from at least one of the first pre-determined distance and the second pre-determined distance, is provided.
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