发明名称 |
ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
An encapsulated semiconductor device includes: a first conduction path formative plate (1); a second conduction path formative plate (5) joined to the first conduction path formative plate; a power element (12) bonded to the first conduction path formative plate; a heatsink (14) held by the first conduction path formative plate with an insulation sheet (13) interposed between the heatsink and the first conduction path formative plate; and an encapsulation resin (9) configured to encapsulate the first and second conduction path formative plates. A through hole (3) or a lead gap (1b) is formed in a region of the first conduction path formative plate in contact with the insulation sheet. The insulation sheet is press-fitted into the through hole or the lead gap.
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申请公布号 |
US2013056885(A1) |
申请公布日期 |
2013.03.07 |
申请号 |
US201213697886 |
申请日期 |
2012.03.26 |
申请人 |
MINAMIO MASANORI;SASAOKA TATSUO;PANASONIC CORPORATION |
发明人 |
MINAMIO MASANORI;SASAOKA TATSUO |
分类号 |
H01L23/36;H01L21/56 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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