| 发明名称 |
FLUX FOR LEAD-FREE SOLDER PASTE, AND LEAD-FREE SOLDER PASTE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a new flux capable of producing a lead-free solder paste which has excellent storage stability and hardly causes sag due to heating even if reflowing in the atmosphere. <P>SOLUTION: The flux for a lead-free solder paste contains a base resin (A) including a polymeric rosin (a1), and a bromine-based activator (B) comprising diols (b1) represented by a prescribed general formula (1) and a quaternary carbon-containing diol (b2) represented by a prescribed general formula (2). <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013046929(A) |
申请公布日期 |
2013.03.07 |
| 申请号 |
JP20120163365 |
申请日期 |
2012.07.24 |
| 申请人 |
ARAKAWA CHEM IND CO LTD |
发明人 |
KUBO NATSUKI;ODA TAKESHI;ISHIGA FUMIO |
| 分类号 |
B23K35/363;B23K35/26;C22C13/00;C22C13/02 |
主分类号 |
B23K35/363 |
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