| 摘要 |
1,237,481. Printed circuits. SIEMENS A.G. 26 Aug., 1969 [27 Aug., 1968], No. 42338/69. Heading H1R. [Also in Divisions C7 and H2] In an integrated circuit &c. having conductive strips formed by vaporization, cathode sputtering, chemical deposition, or electroplating, the contact resistance between superposed conductive strips is reduced by applying electrical energy from a charged capacitor to the junction. The invention is particularly applicable to A1 conductive strips, and the contact resistance may be caused by oxidation, varnish or other foreign matter or absorbed gases, or may result from incidental chemical processes. Preferably the P.D. between the plates of the charged capacitor is between IV. and 20V. Embodiments described include bridging strips deposited over insulation to connect conductive strips on either side thereof, and link conductors which effect connections at cross-over points on a cross-bar matrix. |
