发明名称 |
Semiconductor package and stack semiconductor package having the same |
摘要 |
A semiconductor package includes a semiconductor chip having a first region defined at a center portion of a first surface of the semiconductor chip, and having second and third regions defined on both sides of the first region, respectively. Bonding pads are disposed in the first region and a substrate having a substrate body is disposed in the second region of the semiconductor chip. The substrate includes an extension portion projecting away from the semiconductor chip. The substrate also includes circuit patterns disposed on the substrate body having a first ends placed adjacent to the bonding pads and second ends placed on the extension portion. Connection members electrically connect the first ends of the circuit patterns and the bonding pads. |
申请公布号 |
US8390128(B2) |
申请公布日期 |
2013.03.05 |
申请号 |
US20100834115 |
申请日期 |
2010.07.12 |
申请人 |
NAM JONG HYUN;KIM KI YOUNG;BAE JIN HO;HYNIX SEMICONDUCTOR INC. |
发明人 |
NAM JONG HYUN;KIM KI YOUNG;BAE JIN HO |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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