发明名称 |
Multilayered circuit substrate with semiconductor device incorporated therein |
摘要 |
For the purpose of providing a semiconductor element built-in type multilayered circuit board in which a semiconductor element is closely joined to a recess of an insulating substrate to effectively disperse heat generated from the semiconductor element through the insulating substrate at a working temperature region of the semiconductor element circuit board, to surely conduct an electrical connection of an electronic part such as semiconductor element or the like in a short wiring and to enable the high density mounting of semiconductor elements, miniaturization and increase of working speed, there is proposed a semiconductor element built-in type multilayered circuit board formed by laminating a plurality of semiconductor element built-in type boards each comprising an insulating substrate and a semiconductor element accommodated in a recess formed therein, characterized in that a difference between a linear expansion coefficient of the insulating substrate and a linear expansion coefficient of the semiconductor element in a temperature zone of 20-300° C. is less than 1×10−5/K.
|
申请公布号 |
US8389867(B2) |
申请公布日期 |
2013.03.05 |
申请号 |
US20060529319 |
申请日期 |
2006.09.29 |
申请人 |
ENOMOTO RYO;OHMI TADAHIRO;MORIMOTO AKIHIRO;IBIDEN CO., LTD.;NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY |
发明人 |
ENOMOTO RYO;OHMI TADAHIRO;MORIMOTO AKIHIRO |
分类号 |
H05K1/16 |
主分类号 |
H05K1/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|