发明名称 POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT PREPARED BY MOLDING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a polyamide resin composition which has a low density and improved moldability as well as mechanical properties, is capable of shortening a molding cycle, inhibiting contamination of a deteriorated resin product and a decomposition gas, and providing a molded product excellent in appearance, is excellent in mass productivity since the molding cycle is shortened, and has significantly excellent moldability for molding components subjected to mass production with homogenized quality. <P>SOLUTION: The polyamide resin composition comprises: 100 pts.mass of a polyamide resin containing a terephthalic acid component and a 8-12C straight-chain aliphatic diamine component; and 0.5 to 20 pts.mass of a swelling layer silicate. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013043976(A) 申请公布日期 2013.03.04
申请号 JP20110184791 申请日期 2011.08.26
申请人 UNITIKA LTD 发明人 MUKAI HIROFUMI
分类号 C08L77/06;C08K3/34;C08K9/04 主分类号 C08L77/06
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