| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. <P>SOLUTION: An encapsulant textured using an additive or subtractive process is applied to an LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface reduces total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output distribution. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously. <P>COPYRIGHT: (C)2013,JPO&INPIT |
