发明名称 ELECTRONIC APPARATUS, METHOD FOR MANUFACTURING ELECTRONIC APPARATUS, AND RELAY BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic apparatus excellent in connection reliability. <P>SOLUTION: In an electronic apparatus 1, a circuit board 10 and an electronic component 30 are electrically connected via a relay board 20 arranged therebetween. The relay board 20 includes a heat-expandable insulation substrate 21, a through hole 22 provided in the insulation substrate 21 and a conductive portion 23 provided on an inner wall of the through hole 22. The circuit board 10 and the electronic component 30 are electrically connected by inserting each of protruding electrodes 10a and 30a thereof into the through hole 22 provided in the heat-expandable insulation substrate 21 of the relay board 20 to be brought into contact with the conductive part 23 provided on the inner wall of the through hole 22. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013041905(A) 申请公布日期 2013.02.28
申请号 JP20110176475 申请日期 2011.08.12
申请人 FUJITSU LTD 发明人 FURUYAMA SEIJI;YONEDA YASUHIRO
分类号 H01L23/32;H01L21/60 主分类号 H01L23/32
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