DUMMY FLIP CHIP BUMPS FOR REDUCING STRESS

摘要

PURPOSE: A dummy flip chip bump for reducing stress is provided to increase a throughput by forming a dummy chip on a semiconductor chip. CONSTITUTION: A metal pad(30) is formed on a substrate. A passivation layer forms a part of areas on the metal pad. A PPI(Post-Passivation Interconnect)(38) is electrically coupled with the metal pad. The PPI forms a part of areas on the passivation layer and the metal pad. A polymer layer(36) is located on the PPI. A dummy bump is located on the polymer layer and is electrically insulated from a conductive feature under the polymer layer.