| 摘要 |
PURPOSE: A light emitting device package and a lighting system including the same are provided to implement a thin and light package by forming a circuit board which is opposite to a heat dissipation layer. CONSTITUTION: A first lead frame(220a) and a second lead frame(220b) are arranged on an insulating layer. The first lead frame is electrically separated from the second lead frame. A light emitting device(100) is electrically connected to the first lead frame and the second lead frame. A recessed part is formed in the region of the light emitting device. The second lead frame includes at least one opening region. [Reference numerals] (AA) Open area
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