CUTTING DEVICE FOR SEMICONDUCTOR MATERIAL AND METHOD FOR CUTTING SEMICONDUCTOR MATERIAL

摘要

PURPOSE: An apparatus and method for cutting a semiconductor material are provided to reduce the number of cutting operations in a chuck table. CONSTITUTION: A material aligning unit aligns and receives a plurality of semiconductor materials. A first chuck table moves the plurality of semiconductor materials to and from a material cutting unit. A photographing device(300) photographs at least one of the top and the bottom of the semiconductor material. The position information of the semiconductor material is obtained. A control unit(400) controls a relative motion between a material transfer device(500) and the material aligning unit. [Reference numerals] (1) Input unit; (300) Photographing device; (400) Control unit; (500) Material transfer device; (600) Memory unit; (700) Chuck table; (900) Material cutting unit