发明名称 |
Semiconductor package having an antenna with reduced area and method for fabricating the same |
摘要 |
A semiconductor package includes an electromagnetic shielding member for shielding electromagnetic waves. An antenna is disposed on an upper face of the electromagnetic shielding member and includes an antenna part with a plurality of conductive particles electrically connected with each other and an insulation part disposed on the upper face of the electromagnetic shielding member and insulating the antenna part. Ball lands are disposed on the electromagnetic shielding member and are electrically connected with the antenna part. A Radio Frequency Identification (RFID) chip is electrically connected to the ball lands.
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申请公布号 |
US8383463(B2) |
申请公布日期 |
2013.02.26 |
申请号 |
US201113186713 |
申请日期 |
2011.07.20 |
申请人 |
HYNIX SEMICONDUCTOR INC.;KANG TAE MIN |
发明人 |
KANG TAE MIN |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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