| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a double-sided flip chip package having two or more integrated circuit dies mounted on opposing sides of a substrate. <P>SOLUTION: A semiconductor device module 10 has two or more integrated circuit dies 200a and 200b mounted on opposing sides of a substrate 100. These integrated circuit dies 200a and 200b are mounted by use of surface mount connections, such as flip chip connections implemented using conductive bumps. A system 1 includes one or more semiconductor device modules 10, and in some cases also includes other modules, such as a system module and the like. <P>COPYRIGHT: (C)2013,JPO&INPIT |
