PERFECCIONAMIENTOS EN LA CONSTRUCCION DE ELEMENTOS SEMICON-DUCTORES.

摘要

A method of making a semiconductor element. A first semiconductor body has a pair of first major surfaces on opposite sides. A first contact is provided on and covers one of the first surfaces. A socket plate is conductively connected to the other of the first surfaces and has a first contact pin. A second semiconductor body has a pair of second major surfaces and a second contact provided on and covering one of these second major surfaces. A carrier is connected with the socket plate and the second semiconductor body and located between the two. A second contact pin is provided on the second body at a side thereof facing away from the carrier and a third contact pin is provided, both the second and third contact pins penetrating the socket in insulated relationship. A connecting wire has a straight first end portion conductively secured to the second contact pin, a helically convoluted second portion conductively secured to the third contact pin, and a center portion with respect to which each of the end portions extends at an angle. An additional contact pin is provided on the first semiconductor body at a side thereof facing away from the socket plate and is in direct electrically conductive engagement with the carrier.