| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat-reactive resist material having high durability against dry etching by a fluorocarbon gas to form a pattern with large groove depth, and to provide a laminate for thermal lithography using the material, and a method for manufacturing a mold using the material and the laminate. <P>SOLUTION: The heat-reactive resist material is to be used for dry etching using a fluorocarbon gas; and the material contains at least one kind of element showing, in a primary fluoride thereof, a boiling point of 200°C or higher, and contains an imperfect oxide of element selected from Ti, Fe, Ni, Zr, Nb, Rh, Hf, Ta, Al, Zn, Ga, In, Sn, Sb, Pb and Bi. <P>COPYRIGHT: (C)2013,JPO&INPIT |
