发明名称 |
STACKABLE WAFER LEVEL PACKAGES AND RELATED METHODS |
摘要 |
The present semiconductor device packages include a die, a redistribution layer and a plurality of conductive pillars electrically connected to the redistribution layer. A molding compound partially encapsulates the die and the pillars. A plurality of interconnect patterns on the molding compound are electrically connected to the pillars. The interconnect patterns provide electrical connections for a second, stacked semiconductor package. |
申请公布号 |
US2013037929(A1) |
申请公布日期 |
2013.02.14 |
申请号 |
US201113206346 |
申请日期 |
2011.08.09 |
申请人 |
ESSIG KAY S.;APPELT BERND K. |
发明人 |
ESSIG KAY S.;APPELT BERND K. |
分类号 |
H01L23/48;H01L21/56 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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