LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition for semiconductor encapsulation that can provide a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance; and to provide a semiconductor device encapsulated by using the same.

SOLUTION: The liquid epoxy resin composition for semiconductor encapsulation comprises: (A) at least one epoxy resin; (B) at least one curing accelerator; and (C) at least one acid anhydride terminated polyamic acid. Thus, the liquid epoxy resin composition has good curability and fluidity, can improve the adhesiveness between the semiconductor chip surface and the cured material of the liquid epoxy resin composition and additionally can reduce the degradation of adhesiveness, even in the presence of moisture.

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