| 摘要 |
<p>PURPOSE: A semiconductor laminate package and a manufacturing method thereof are provided to easily form a laminate package by arranging an interposer with a plurality of connection pads on the upper side of a bottom package even though a top package has a lot of I/O terminals. CONSTITUTION: A semiconductor chip(110) is mounted on a rewiring layer(120). A first conductive member(141) is formed around the semiconductor chip and is formed at the same height as the semiconductor chip. A second conductive member(143) is formed at the same height as a molding member(130). The molding member surrounds the semiconductor chip, the first conductive member, and the second conductive member. An interposer(150) is electrically connected to the first conductive member.</p> |
