Laminated template for semiconductor device bonding

摘要

A method and apparatus for magnetically transferring integrally leaded semiconductor chips from a temporary carrier to a lead frame structure for permanent bonding thereto. A laminated template having a plurality of recesses within one surface thereof serves as the temporary carrier. A soft ferromagnetic probe of a transfer apparatus extends through an opening in the template opposite each recess to engage the back side of a chip therein. The probe raises the chip into close proximity with overlying lead frame fingers. A magnetic force transmitted through the probe raises the chips the rest of the way to and concurrently aligns them with the lead frame fingers.