| 摘要 |
The invention aims at providing a film for demoulding, which is advantaged by excellent stripping performance of forming products obtained by molding resin forming and processing with a molding mould, high strength of heat resistance, and no fusing of the film even under a use temperature of more than 200 DEG. A fluorosilicone compound layer is formed at least one surface of the film for demoulding. The film is obtained by forming of a resin composition comprising thermoplastic resin or forming of a resin composition with thermoplastic resin as the main component and a thermoplastic elastic body mixed. The fluorosilicone compound layer is obtained via coating and drying a demoulding composition on the film, wherein, the demoulding composition comprises a fluorosilicone compound provided with a monosilane group comprising a hydrolyzing part in a molecule. |
