ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE INTEGRATED WITH DICING FILM, AND SEMICONDUCTOR DEVICE CONTAINING ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive sheet for manufacturing a semiconductor device, capable of suppressing diffusion of cation in the adhesive sheet for manufacturing a semiconductor device.

SOLUTION: The adhesive sheet for manufacturing a semiconductor device is used for pasting a second semiconductor chip on a first semiconductor chip where a bonding wire is connected to its upper surface, so that a part of the bonding wire is embedded in the adhesive sheet for manufacturing a semiconductor device. It contains an ion capturing agent, with a glass transition temperature after thermo-setting being 50°C or higher.

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