| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit connection material exhibiting high adhesive strength, and capable of sufficiently suppressing the generation of peeling bubbles at an interface between a circuit member and the circuit connection material in the case of a connected body is left in a high-temperature high humidity environment. <P>SOLUTION: The circuit connection material contains (a) a thermoplastic resin, (b) a radical polymerizable compound, and (c) a radical polymerization initiator, wherein (b) the radical polymerizable compound is represented by formula (1), and satisfies the condition of the following expression (I): 10≤S2/S1≤14, wherein S1 is an integral value of a spectrum measured in the chemical shift value of 2.75 to 3.10 ppm in<SP POS="POST">1</SP>HNMR with tetramethylsilane as an internal standard; and S2 is an integral value thereof in 3.90 to 4.25 ppm. In the formula (1), R<SP POS="POST">1</SP>is a hydrogen atom or a methyl group; j is an integer of 1 to 3; k is an integer of 2 to 7; m is an integer of 4 to 8; and n is an integer of 5 to 7. <P>COPYRIGHT: (C)2013,JPO&INPIT |
