| 摘要 |
PURPOSE: A laser dicing method is provided to improve a division property by optimizing the irradiation condition of a pulse laser beam. CONSTITUTION: A raw substrate is loaded in a stage(20). A laser generator(12) emits a pulse laser beam(PL1) synchronized with a clock signal(S1). A pulse peaker(14) synchronizes the clock signal to control the pulse laser beam. A first laser beam irradiation process is performed on the raw substrate on a first line. A second laser beam irradiation process is performed on a second line. Cracks are formed on the surface of the raw substrate by performing the first and the second laser beam irradiation process. [Reference numerals] (12) Laser generator; (14) Pulse peaker; (16) Beam trimmer; (18) Condensing lens; (20) XYZ stage part; (22) Laser generating control part; (24) Pulse peaker control part; (28) Reference clock oscillation part; (30) Processing table part |
