Apparatus, system and method for use in mounting electronic elements

摘要

The present embodiments provide apparatuses, systems and methods of manufacturing surface mountable devices. Some embodiments provide surface mount devices that comprise a casing comprising a recess formed in the casing and extending into the casing, an insert secured with the casing and extending about the recess defining a portion of a surface of the recess with the insert comprising a reflective surface exposed along the recess, and a plurality of leads partially exposed through the recess.