| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a conductive paste good in workability, excellent in heat resistance, moisture resistance and weather resistance, and capable of achieving highly reliable physical/electrical junction in joining a semiconductor element with a various base materials; and a semiconductor device manufactured using the conductive paste. <P>SOLUTION: The conductive paste contains: (A) a soluble polyimide resin; (B) a solvent; and (C) flake-like silver powder having a specific surface area (SA) of 0.3-1.3 m<SP POS="POST">2</SP>/g and a tap density (TD) of 3.0-6.0 g/cm<SP POS="POST">3</SP>. In the semiconductor device, a semiconductor element is bonded on a semiconductor element support member with the conductive paste. <P>COPYRIGHT: (C)2013,JPO&INPIT |
