发明名称 |
LEAD FRAMELESS HERMETIC CIRCUIT PACKAGE |
摘要 |
<p>A open cavity semiconductor chip package that is leadless and does not have a metal lead frame as in conventional packages. The absence of a lead frame minimizes leakage paths and allows the novel package to be more readily fabricated as a hermetic package. A dual sided insulative or dielectric film is employed as the base interconnect between a semiconductor chip and outside contacts. Electrical connection from the top side of the film to the bottom side of the film is made through conductive micro-vias. The semiconductor chip is mounted on a paddle in a central opening in the film and wire bonded to pads on the film. After mounting of the chip, a cover or lid is attached to the film to encapsulate the assembly and maintain hermeticity of the package.</p> |
申请公布号 |
WO2013016335(A2) |
申请公布日期 |
2013.01.31 |
申请号 |
WO2012US47973 |
申请日期 |
2012.07.24 |
申请人 |
INTERPLEX INDUSTRIES, INC. |
发明人 |
SCHNEIDER, RICHARD;EYMARD, ERIC |
分类号 |
H01L23/48;H01L23/12 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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