| 摘要 |
The present invention relates to a system for a laser drilling process on a package to manufacture a PoP (Package on Package). The present invention can: efficiently perform laser drilling on a package, effectively remove contamination caused by the laser drilling from the package, and realize a processing system with a new layout which uses an automatic concept for connecting a laser process with a washing process to increase UPH (Units Per Hour) in order to manufacture a stacked package assembly of a PoP type. Therefore, the present invention provides a semiconductor package processing system which can improve overall productivity. |
